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Capabilities

Sr. No.
Item
Capability
1. Base Material Normal Tg FR4, High Tg FR4, PTFE, Rogers, Low Dk/Df etc.
2. Solder Mask Color Green, Red, Blue, White, Yellow, Black
3. Legend Color White, Yellow, Black, Red
4. Surface Treatment Type ENIG, Immersion Tin, HAF, HAF LF, OSP, Flash Gold, Gold Finger, Sterling Silver
5. Max. Layer-Up(L) 50
6. Max. Unit Size (mm) 620*813 (24″*32″)
7. Max. Working Panel Size (mm) 660*900 (24″x35.4″)
8. Max. Board Thickness (mm) 8
9. Min. Board Thickness(mm) 0.3
10. Board Thickness Tolerance (mm) T1.0≤T＜1.6mm:±0.13mm;

1.6≤T＜2.0mm:±0.15mm;

2.0≤T＜2.4mm:±0.20mm;

2.4≤T＜3.0mm:±0.25mm;

3.0≤T＜3.5mm:±0.28mm;

3.5≤T＜4.0mm:±0.30mm;

T≥4.0mm:     ±10%
11. Registration Tolerance (mm) +/-0.10
12. Min. Mechanical Drilling Hole Diameter(mm) 0.15
13. Min. Laser Drilling Hole Diameter(mm) 0.075
14. Max. Aspect（Through Hole) 18:1
15. Max. Aspect（Micro-Via) 1.3:1
16. Min. Hole Edge To Copper Space(mm) 0.15
17. Min. Innerlay Clearance(mm) 0.15
18. Min. Hole Edge To Hole Edge Space(mm) 0.28
19. Min. Hole Edge To Profile Line Space(mm) 0.2
20. Min. Innerlay Copper To Profile Line Sapce (mm) 0.2
21. Registration Tolerace Between Holes (mm) ±0.05
22. Max. Finished Copper Thickness(um) Outer Layer: 280   (8oz)

Inner Layer: 280   (8oz)
23. Min. Trace Width (mm) 0.075 (3mil)
24. Min. Trace Space (mm) 0.075 (3mil)
25. Solder Mask Thickness (um) Line corner :  >8 (0.3mil)

Upon copper: >10 (0.4mil)
26. ENIG Golden Thickness (um) 0.025-0.125
27. ENIG Nickle Thickness (um) 3-9
28. Sterling silver thickness (um) 0.15-0.75
29. Min. HAL Tin Thickness (um) 0.75
30. Immersion Tin Thickness (um) 0.8-1.2
31. Hard-Thick Gold Plating Gold Thickness  (um) 1.27-2.0
32. Golden finger plating gold thickness (um) 0.025-1.51
33. Golden Finger Plating Nickle Thickness(um) 3-15
34. Flash Gold Plating Gold Thickness (um) 0,025-0.05
35. Flash Gold Plating Nickle Thickness  (um) 3-15
36. Profile Size Tolerance (mm) ±0.08
37. Max. Solder Mask Plugging Hole Size (mm) 0.7
38. BGA Pad (mm) ≥0.25 (HAL or HAL Free：0.35)
39. V-CUT Blade Position Tolerance (mm) +/-0.10mm
40. V-CUT Position Tolerance (mm) +/-0.10mm
41. Gold Finger Bevel Angle Tolerance (o) +/-5
42. Impedence Tolerance (%) +/-5%
43. Warpage Tolerance (%) 0.75%
44. Min. Legend Width  (mm) 0.1mm
45. Fire Flame Class 94V-0
Special For Via In Pad Products
 Resin Plugged Hole Size (min.) 0.30mm
Resin Plugged Hole Size (max.) 0.75mm
Resin Plugged Board Thickness (min.) 0.40mm
Resin Plugged Board Thickness (max.) 3.50mm
Resin Plugged Maximum Aspect Ratio 10:1
Resin Plugged Minimum Hole To Hole Space 0.40mm
Can Difference Hole Size In One Board? yes
Back Plane Board
 Item year-2011
Max. Panel Size (Finished) 950mm × 620mm
Max. Working Panel Size (mm) 1100mm × 660mm
Max. Board Thickness (mm) 10mm
Max. Layer-Up(L) 60
Aspect 20:1
Line Wide/Space 0.075mm/0.075mm
Back Drill Capability Yes
Tolerance of Back Drill ±0.05mm
Tolerance of  Press Fit Holes ±0.05mm
Surface Treatment Type OSP, sterling silver, ENIG
Rigid-Flex Board
 Hole Size 0.20mm
Dielectrical Thickness 0.025mm
Working Panel Size 350mm x 500mm
Line Wide/Space 0.075mm/0.075mm
Stiffener Yes
Flex Board Layers 6
Rigid Board Layers ≥14
Surface Treatment All
Flex Board In Mid or Outer Layer Both
special for HDI products
 Laser Drilling Hole Size 0.075mm
Max. Dielectric Thickness 0.15mm
Min. Dielectric Thickness 0.05mm
Max. Aspect 1.5:1
Bottom Pad size (Under Micro-Via) (Hole size+0.15）mm
Top side Pad size ( On Micro-Via) ( Hole size+0.15）mm
Copper Filling Yes
Via In Pad Design Yes
Buried Hole Resin Plugged Yes
Min. Via Size Can Be Copper Filled 0.1mm
Max. Stack Times 4